ITT Cannon High Temperature Micro D-Subminiature Connectors
Designed in Accordance with MIL-DTL-83513
ITT Cannon’s MDM connectors are used in applications that require highly reliable, extremely small, and lightweight connectors with higher-density contact configurations than are available in traditional rectangular connectors. They are available in eight shell sizes accommodating from nine to one hundred contacts, and special arrangements of power and coaxial contacts. These connectors are designed to meet the rapidly increasing demands for an environmental, high performance, rugged, moisture-sealed microminiature connector.

With the increasing demand for compact, ruggedized interconnect solutions that can withstand temperatures up to 200°C, ITT’s Cannon brand continues to lead the industry with high reliability products customized for applications from satellites to down hole analyzers. Designed in accordance with MIL-DTL-83513, these high performance D-sub connectors are exceptionally versatile and feature micro sockets (free standing, used in receptacle side) and micro twist pins (recessed into plug insulators).

Features
  • Designed in Accordance with MIL-DTL-83513
  • High Reliability and Exceptional Versatility
  • Micro Twist Pins Recessed into Plug Insulators
  • Current Rating: 3 A
  • Durability: 500 Mating Cycles
  • Contacts: Copper Alloy, Gold Plated
  • Low Profile Configurations Are Available
  • Operating Temperature Range: -55°C to +200°C
PDF Micro D-Subminiature Brochure >>
PDF Micro D-Subminiature Datasheet >>
Applications
  • Space/Satellite
  • Military Electronics
  • Avionics
  • Missile Systems
  • Test Equipment
  • Data Acquisition
  • Down Hole Drilling
  • Instrumentation
  • Industrial
 
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